Plasma Etcher

High-density plasma, fast etching speed, uniform flow design to ensure etching uniformity <±3%

■ The wafer temperature is controllable , and the process flexibility is strong. Each batch of 8 4-inch wafers has high production efficiency.

■ Automatic control, stable and reliable, good repeatability.

■ External Dimensions Weight:

• L: 4000 x D: 1650 x H: 2030mm

■ heavy   quantity:

• Weight about 250kg