Manual double-sided exposure machine (Aligner) Regular price

Exposure machines 3", 4", 5", 6", 8' 300-CC . This equipment is a photomask alignment exposure machine used in semiconductor lithography process.

Function: Use UV parallel light source to make 1:1 copy of the pattern of the photomask to the photoresist film on the wafer surface.

The best vacuum contact exposure pattern resolution is within 1um (positive photoresist thickness is 1um)

■ Equipment Specifications:

• Exposure light source , mask line width reproduction capability , I-line positive photoresist 1um thickness, hard contact, 1um~2um,
  proximity 3um~5um.

■ Align the imaging system:

• Automatic alignment ability, the align key with clear geometric shape can be identified within 5um.

■ production   can:

• For the alignment process , the exposure time is 3 seconds, and the mechanical capacity is 250 to 300 pieces per hour (without considering the material variability).

• No alignment, only exposure process, exposure time of 3 seconds, mechanical capacity of 280~360 pieces per hour (without considering material variability and unloading).

■ External Dimensions Weight:

• W: 1900 x D1600 x H2400mm

■ heavy   quantity:

• Weight about 1900kg